High precision testing equipment for semiconductor chip packagingIt is a testing equipment developed by Kewei Instruments for high-precision and high-efficiency measurement of small and precise semiconductor products. The design concept pursues simplification, using 8x or 13X object side telecentric tube with 10X/0.3 high-resolution metallographic objective lens to achieve precise and accurate measurement requirements.

Automatic measurement module

The intuitive measurement interface facilitates operators to immediately detect workpieces that have not passed the inspection and products that exceed the tolerance range.

Without the need for precise placement of the tested workpiece, the operator can quickly load multiple pieces of workpiece, and the system automatically recognizes and measures the tested product.

Automatically collect all necessary data for statistics and create a report for each measured item without additional time.

Measurable elements: length, distance, inner diameter, outer diameter, angle, parallelism, symmetry, orthogonality, any geometric measurement of contour, DXF ratio, etc.

Professional application, designed for semiconductor measurement only

• Measure the position and size of the chip
• Measure the XY position of the chip
• Measure the concentricity of the chip after sealing the cap
• Measure the concentricity, height, and solder pad size of the chip after eutectic bonding
• Measure the height of solder pads and wire arcs
• The chip and substrate of PCB, the height and angle of the chip after insertion
• Binding line height

Specification parameters: